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1

Characterization of chip scale packaging materials

Masazumi Amagai

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 330 KB

english, 1999

2

The effect of polyimide surface chemistry and morphology on critical stress intensity factor

Masazumi Amagai

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 490 KB

english, 2000

3

Mechanical reliability in electronic packaging

Masazumi Amagai

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 1.28 MB

english, 2002

4

A study of nanoparticles in Sn–Ag based lead free solders

Masazumi Amagai

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 4.93 MB

english, 2008

5

Investigation of stress singularity fields and stress intensity factors for cracks

Masazumi Amagai

Journal:

Finite Elements in Analysis and Design

Year:

1998

Language:

english

File:

PDF, 702 KB

english, 1998

6

Mechanical characterization of Sn–Ag-based lead-free solders

Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 1.01 MB

english, 2002

7

Fatigue Characteristics of Solder Joints in BGA-IC Package due to Vibration (1st Report, Comparison of Package of Pb-free Solder Ball with That of Pb Solder Ball Under a Transverse Vibration)

KIM, Young-Bae, NOGUCHI, Hiroshi, AMAGAI, Masazumi

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2004

Language:

english

File:

PDF, 4.46 MB

english, 2004

8

Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder

YoungBae Kim, Hiroshi Noguchi, Masazumi Amagai

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 382 KB

english, 2006

9

Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package

KIM, YoungBae, NOGUCHI, Hiroshi, AMAGAI, Masazumi

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2006

File:

PDF, 2.44 MB

2006

10

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Package-On-Package Mechanical Reliability Characterization

Amagai, Masazumi, Suzuki, Yutaka, Abe, Kenji, Kim, YoungBae, Sano, Hitoyuki

Year:

2007

Language:

english

File:

PDF, 2.41 MB

english, 2007

11

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Board level drop test modeling

Amagai, Masazumi, Seungmin, Jang

Year:

2012

Language:

english

File:

PDF, 1.00 MB

english, 2012

12

[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Warpage modeling for 3D packages

Amagai, Masazumi, Suzuki, Yutaka

Year:

2012

Language:

english

File:

PDF, 256 KB

english, 2012

13

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Mechanical reliability modeling and characterization for Package-on-Package

Masazumi Amagai,, Yutaka Suzuki,, Kenji Abe,, YoungBae Kim,, Hitoyuki Sano,

Year:

2008

Language:

english

File:

PDF, 1.11 MB

english, 2008

14

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Unique adhesion testing and MSL modeling

Amagai, Masazumi, Takao, Kentaro

Year:

2013

Language:

english

File:

PDF, 1.68 MB

english, 2013

15

Chip Surface Damage Induced by Internal Stress of Lead–ON–Chip (Loc) Packages

Amagai, Masazumi, Kawasaki, Eiji

Journal:

MRS Proceedings

Year:

1994

Language:

english

File:

PDF, 1.87 MB

english, 1994

16

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Study on fatigue strength characteristics for solder joints

Daisuke Kaneko,, Hirotsugu Inoue,, Kikuo Kishimoto,, Masaki Omiya,, Masazumi Amagai,

Year:

2007

Language:

english

File:

PDF, 6.02 MB

english, 2007

17

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Board level drop test modeling for system-in-packages

Amagai, Masazumi, Yamada, Eiichi

Year:

2009

Language:

english

File:

PDF, 635 KB

english, 2009

18

Evaluation of Impact Strength due to Thermal Degradation for BGA-IC Package

KIM, Youngbae, NOGUCHI, Hiroshi, AMAGAI, Masazumi

Journal:

Journal of Solid Mechanics and Materials Engineering

Year:

2007

Language:

english

File:

PDF, 1.49 MB

english, 2007

19

[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - Prediction of board level reliability of drop test for system-in-package

Eiichi Yamada,, Masazumi Amagai,

Year:

2008

Language:

english

File:

PDF, 2.50 MB

english, 2008

20

[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Board level drop test modeling

Amagai, Masazumi, Seungmin, Jang

Year:

2012

Language:

english

File:

PDF, 250 KB

english, 2012

21

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Manufacturability, Yield, and Reliability - Temperature-cycle-induced chip surface damage in lead-on-chip packages

Amagai, Masazumi, Vasquez, Barbara, Kawasaki, Hisao

Year:

1994

Language:

english

File:

PDF, 493 KB

english, 1994

22

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - TSV stress testing and modeling

Amagai, Masazumi, Suzuki, Yutaka

Year:

2010

Language:

english

File:

PDF, 1.22 MB

english, 2010

23

[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - A study of material properties for package flatness in 3D package

Suzuki, Yutaka, Amagai, Masazumi

Year:

2008

Language:

english

File:

PDF, 1.73 MB

english, 2008

24

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - A study of package warpage for package on package (PoP)

Amagai, Masazumi, Suzuki, Yutaka

Year:

2010

Language:

english

File:

PDF, 862 KB

english, 2010

25

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Effect of Ni Plating Thickness on Fatigue Failure of Lead-free Solder Joints

Omiya, Masaki, Miyazaki, Takeshi, Inoue, Hirotsugu, Kishimoto, Kikuo, Amagai, Masazumi

Year:

2006

Language:

english

File:

PDF, 1.86 MB

english, 2006

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